Programs developed to meet your needs Deposition Services.
High-quality surface defect contamination standards:
· improve overall performance of your semiconductor manufacturing inspection systems,
· reduce inconsistencies within your inspection/metrology tool fleet, and
· maximize device yield
MSP, a Division of TSI, supplies wafer contamination standards and reticle contamination standards in the semiconductor industry for consistent and repeatable particle size and count control.
MSP provides certified standards for wafer and reticle inspection tools for developing, qualifying, calibrating, and monitoring wafer and reticle/photomask inspection systems. Particles of specified size, composition, and count are deposited on your substrate of choice, including wafers, 6-inch reticles (any type), and other less common substrates. Particles can be deposited on bare, film, and patterned wafers from 100mm to 300mm.
Download the Wafer & Photomask Surface Defect Contamination Standards brochure to learn how MSP can help improve your surface defect inspection!
Develop. Deploy. Deliver.
Our wafer and reticle contamination standards are used for the development of semiconductor inspection tools, process tools, and manufacturing processes. They are used in fabs with inspection systems and processes for qualification and acceptance, as well as for maintenance of equipment/processes and performance for the duration of their service lives. MSP’s contamination standards enable high-volume manufacturing (HVM) and delivery of electronic devices.
Develop: MSP Dev-Dep™ Development Contamination Standards
MSP Dev-Dep™ Development Contamination Standards help accelerate product and process development. These standards are totally customized to suit the unique and challenging requirements of your application with support from MSP's particle deposition experts.
Deploy: MSP Qual-Dep™ Qualification Contamination Standards
MSP Qual-Dep™ Qualification Contamination Standards accompany inspection systems installed in semiconductor fabs. These are tool-specific standards which reliably demonstrate in-field performance, reduce risk to acceptance, and help match systems. OEM wafer and reticle contamination standards can be purchased in volume with dedicated part numbers and lower prices.
Deliver: MSP Cal-Dep™ Calibration Contamination Standards
Inspection systems need to be calibrated regularly throughout their service lives to ensure consistent performance, which is critical for statistical process control (SPC) as part of advanced process control (APC) in device manufacturing. MSP Cal-Dep™ Calibration Contamination Standards are highly accurate standards to help you maintain your tool’s performance, so your manufacturing process can consistently deliver high-quality product. Deposited with well-defined recipes, these wafer/photomask contamination standards can be produced quickly for fast delivery.
Accurate and Traceable. Precise and Repeatable.
Our Differential Mobility Analyzers (DMA) precisely control the mode (peak) of, and variation in, deposited particle diameter. DMAs are calibrated with SI traceability using the best available particle size reference materials, including PSL spheres from NIST.
MSP’s particle size (10 nm to 20 μm) and count (400 to >100,000 particles per deposit) are extremely repeatable from substrate to substrate. Spot diameter (typically 10-30 mm) and spot location are consistent from deposit to deposit (adjustable with sub-millimeter precision).
Our quick substrate processing speed means your contamination standards are returned to you swiftly. The faster the turnaround, the faster your product can be developed, qualified, and calibrated.
MSP’s Wafer and Reticle Contamination Standards meet today’s inspection and metrology applications, including:
· Traceable calibration and matching legacy calibration standards
· Incoming bare wafer inspection/qualification
· Blanket film monitoring
· Incoming reticle inspection/qualification
· Production reticle monitoring
· Inspection tool development and qualification
· Process tool qualification and monitoring
晶圓與光罩表面污染/缺陷檢查系統校正標準片晶圓與光罩表面污染/缺陷檢查系統校正標準片
特色與效益
準確性和可追溯性
差動流動性分析儀（DMA）技術能夠精確控制沉積顆粒直徑的模態（峰值）和變異性。DMA使用最佳的可用顆粒大小參考材料進行校準，包括NIST的PSL球形顆粒。校準工作每週進行監控。
精確性和可重復性
顆粒大小（10納米到20微米）和數量（每次沉積400到>100,000顆粒）在不同基材之間非常重複性。斑點直徑（通常為10-30毫米）和斑點位置在每次沉積中保持一致（可調節至亞毫米級別的精度）。
DESCRIPTION
準確性和可追溯性
差動流動性分析儀（DMA）技術能夠精確控制沉積顆粒直徑的模態（峰值）和變異性。DMA使用最佳的可用顆粒大小參考材料進行校準，包括NIST的PSL球形顆粒。校準工作每週進行監控。
精確性和可重復性
顆粒大小（10納米到20微米）和數量（每次沉積400到>100,000顆粒）在不同基材之間非常重複性。斑點直徑（通常為10-30毫米）和斑點位置在每次沉積中保持一致（可調節至亞毫米級別的精度）。
更快的學習週期
MSP在基材處理速度方面領先於行業。回轉速度越快，學習週期越快，產品的開發速度也越快。
認證和質量控制
已沉積的200mm和300mm晶圓可以通過內部掃描表面檢測系統（SSIS）進行檢查。對於光罩（網版）和其他基材，MSP會在證人晶圓上沉積顆粒，並使用SSIS檢查沉積物以確認過程的合格性。每個基材都經過精心處理，並使用我們的標誌性三重包裝進行包裝，以防止在運輸過程中受到污染。
客製化
MSP將根據您對顆粒大小和成分、沉積數量以及基材上的沉積模式類型、大小和位置的要求提供報價和草擬配方。可供選擇的斑點、弧形、環形和全覆蓋模式類型。我們庫存了100多種尺寸標準（從10納米到20微米），提供14種顆粒材料。